Fast Circuits Inc.

Circuit Board Capabilities

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Printed Circuit Board Capabilities

We encourage you to become familiar with our printed circuit board manufacturing competencies. Use the information detailed in the following charts to determine that we are capable of producing with our internal staff. Since we are modifying our PCB production resources, the following information should be considered as the minimum level of services we are capable of providing.

How To Send the Gerber RS-247x files?

The Gerber RS-247x files can be sent either by telephone, the website online quoting form, or by email. Feel free to phone or email us your questions about our PCB production facilities, resources, or competencies. Thank you for your time. We guarantee 100% customer satisfaction and hope to have a long partnership with you. We are in business to help your business!

Our PCB Capabilities:

 
Supported Capabilities
Layers
0-30
PCB Material
FR-4 (Tg - 135C, 145C, 170C)
Rogers Ultralam 2000
Rogers RO4350
Rogers RO4003
Polyimide
Teflon
Black FR-4
Arlon AR-350
Getek Copper Clad Thermal Substrate
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013
Type of Stiffener
Thermo Set, PSA-Based Al
FR-4
Stainless Steel
Polymide
Total Thickness (Min - Max)
2-Layer: 0.005" -- 0.250"
4-Layer: 0.015" -- 0.250"
6-Layer: 0.025" -- 0.250"
8-Layer: 0.031" -- 0.250"
10-Layer: 0.040" -- 0.250"
12-Layer: 0.047" -- 0.250"
14-Layer: 0.054" -- 0.250"
16-Layer: 0.062" -- 0.250"
18-Layer: 0.093" -- 0.250"
20-Layer: 0.125" -- 0.250"
22-Layer: 0.125" -- 0.250"
24-Layer: 0.125" -- 0.250"
Core-Thickness(Min)
0.0025"
Max Size
2-Layer: 20" x 28"
Multi-layer: 16" x 26"
Min Space for Conductor
0.003"
Min Width for Conductor
0.003"
Min Hole Size
0.006"
Finish-Plating and Surface-Finish
HASL: Leaded Solder Tin/Nickel
HASL: Pb Free Solder
Electroless, Soft Gold
Wire-Bondable, Soft Gold
Nickel-Flash Gold
Electroless Ni
Immersion-Gold
Electrolytic Nickel or Hard-Gold and Selective-Gold
Immersion-Silver
Immersion-Tin
Carbon-Ink
Finished Cu (Min Outer Layers)
3 oz Copper: 0.008" Trace per Space
4 oz Copper: 0.010" Trace per Space
5 oz Copper: 0.012" Trace per Space
Finished Cu (Min Inner Layers)
.5 oz Copper: 0.004" Trace per Space
1 oz Copper: 0.005" Trace per Space
2 oz Copper: 0.006" Trace per Space
3 oz Copper: 0.010" Trace per Space
4 oz Copper: 0.012" Trace per Space
Clearance for Inner Layers
0.008" (minimum)
Min Finished Hole Size:
Final Thickness <=0.062" - 0.006" Hole Final Thickness 0.150" - 0.014" Hole
Final Thickness 0.093" - 0.010" Hole Final Thickness 0.200" - 0.018" Hole
Final Thickness 0.125" - 0.012" Hole Final Thickness 0.250" - 0.020" Hole
Gold Fingers (Edges)
1 - 4
Type of Solder-Mask
IPC-SM-840
LPI
Peelable
Solder-Mask (Colors)
Green / Green
Matte: White
Black / Black
Matte: Clear
Blue Top / Bottom Mix
Red One / Both Sides Mix
Type of Silkscreen
Thermal Cure Epoxy Ink
LPI Ink
Silkscreen (Colors)
White
Black
Yellow Top / Bottom Mix
Red One or Both Sides Mix
Blue
CNC Functions
Scoring Edge to Edge Plated Counter bores
Skip Scoring: .250" Spacing Milling
30 or 60 Deg. Score Angle Blind and Buried Vias
30 to 100 Deg. Counter-sink Controlled Z Axis Route
15 to 45 Deg. Gold Finger Bevel Castellated Barrels
Counter-bores Offset or Recessed Beveling
Plated Counter-sinks
Other Services
Blind and Buried Vias
Plated Slots Specified Dielectric
Tented Vias Controlled Impedance
Solder mask Plugged Vias Via Caps (Solder Mask)
Conductive Filled Vias
Quality Testing
IPC Class III Continuity Resistance: 10 - 20 ohm
Net List Test per IPC-356D Isolation Resistance: 2 - 30M ohm
Test Voltage: 100 -250 V Minimum SMT Pitch 0.5 mm
PCB Tolerances
PTH Hole Size: +/- 0.002"
Front to Back: +/- 0.002"
NPTH Hole Size: +/- 0.001"
Solder Mask: +/- 0.002"
Tooling Holes: +/- 0.001"
Hole to Pad: +/- 0.005"